PANDA (antiProton ANnihilation in DArmstadt) is the central experiment to fully exploit the physics research potential of antiproton beams at the international accelerator Facility for Antiproton and Ion Research in Europe (FAIR), currently under construction at GSI. Phase-space cooled high intensity antiproton beams up to 15 GeV/c will be provided by the High Energy Storage Ring (HESR) at FAIR to interact with PANDA internal proton or nuclear targets enabling a broad range of exciting studies in Particle and Nuclear Physics. The PANDA detector features two spectrometers, the Target Spectrometer with a superconducting solenoid magnet of 2 T around the interaction region with hermetic coverage and the Forward Spectrometer with a 2 Tm dipole magnet for coverage of the forward boosted particles. Several modern particle detector systems are employed in PANDA to provide excellent charged particle tracking, particle identification, calorimetry and muon detection, over the full momentum range in both spectrometers throughout the lifetime of the experiment. Focusing on the various PANDA detector systems we present an overview of recent developments, the detector construction progress and conclude with an outline for a phased deployment of PANDA at FAIR.

The PANDA-Experiment will be a fixed target experiment at the future FAIR-accelerator center at Darmstadt, Germany. As the experiment is designed for high precision measurements with an antiproton beam, especially in the charm sector of hadron spectroscopy, a precise knowledge of the luminosity is crucial. The determination of the luminosity will be done by measuring the angular distribution of elastically scattered antiprotons at very small scattering angles between 3 and 8 mrad. Therefore their tracks will measured by four layers of thinned HV-MAPS silicon sensors of 50μm thickness. To minimize the multiple scattering, the measurement is performed in vacuum. As the sensors will dissipate up to 7mW/mm^2, an active cooling is mandatory. To achieve this while maintaining a low material budget, the sensors will be glued on 200 μm thin CVD-diamonds which are clamped in an actively cooled aluminium heatsink outside of the acceptance. An excellent thermal contact to the stainless steel pipe for the coolant is ensured by melting the aluminium around the pipe before machining the heatsink. The poster will present the mechanical design and the cooling system.